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 Thermal Sensors Moxie®    Download PDF

TS3
Thermal Sensor MOXIE®
Moxies are a family of, variable resistance thermal sensors having a highly specific "transition region." Within this transition region the devices typically exhibit a negative temperature coefficient ranging from 40% per °C to 200% per °C. Below the transition region they exhibit a linear "thermistor" characteristic of -2 to -4%/°C.

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Applications
Sensors for temperature protection, control and limiting.
Voltage, current and frequency limiters in electronics.

Examples: Overtemperature protector for power semi-conductors, such as transistors, power output stages, amplifiers.
   
Dimensions  
TS3
 
TS3 B3
 
TS3 C3
 
 
Specifications

Type Parameter Temp, (°C) Condition Min. Typ. Max. Units
TS3-57
Resistance 35 Heating 35 85 230 k
Resistance 57 Heating   1.0   k
Resistance 75 Heating 15 45 100
Sensitivity (1) 57 Heating 40 100   % / °C
Latching Current (2) - D.C. Volts 0.6 1.8 3.2 mA

Type Parameter Temp, (°C) Condition Min. Typ. Max. Units
TS3-60
Resistance 35 Heating 50 130 350 k
Resistance 60 Heating   5   k
Resistance 75 Heating 20 75 250
Sensitivity (1) 60 Heating 40 100   % / °C
Latching Current (2) - D.C. Volts 0.6 1.6 2.8 mA

Type Parameter Temp, (°C) Condition Min. Typ. Max. Units
TS3-65
Resistance 40 Heating 120 620 1700 k
Resistance 65 Heating   5.0   k
Resistance 80 Heating 10 50 100
Sensitivity (1) 65 Heating 80 200   % / °C
Latching Current (2) - D.C. Volts 0.14 0.33 0.52 mA

Type Parameter Temp, (°C) Condition Min. Typ. Max. Units
TS3-75
Resistance 55 Heating 40 80 300 k
Resistance 75 Heating   3.0   k
Resistance 95 Heating 20 115 200
Sensitivity (1) 75 Heating 50 70   % / °C
Latching Current (2) - D.C. Volts 0.7 1.9 3.1 mA

Type Parameter Temp, (°C) Condition Min. Typ. Max. Units
TS3-85
Resistance 65 Heating 25 45 180 k
Resistance 85 Heating   1.5   k
Resistance 100 Heating 75 150 330
Sensitivity (1) 85 Heating 30 40   % / °C
Latching Current (2) - D.C. Volts 1.4 2.0 2.6 mA

1 Sensitivity is defined as the percentage of resistance change per variation of 1†C in temperature.
2 Latching current is the smallest current that will cause the device to make changes in resistance while it’s cooling to a lower temp.

 
Typical Characteristics TS3-XX TS3-XXB3
Thermal Resistance (†C/W)
 
- Die to tab (or casing)
250
300
- Tab (or case) to air
200
200
Time Constant (sec)
   
- Air to tab (or casing)
60
60
- Tab (or case) to die
2.0
2.5
Shunt Capacitance (pF)
 
- Lead to lead
0.5
0.5
- Lead to tab (or casing)
0.2
0.2
Dialectric Withstanding (V dc)
 
- Lead to tab (or casing)
600
600
Storage Temp. (†C)
120
120
Solder Temp.
 
(1/16” from case, 10 sec)
260
260

Typical Response
Characteristics
TS3-57 TS3-60 TS3-65 TS3-75 TS3-85
Temp.Coef. (%/†C)
 
Pre-Transition
-2.0
-2.5
-4.0 -3.5 -3.0
Transition
-100
-100
-200 -70 -40
Post-Transition
-0.25
-0.25
-0.5 -1.0 -1.5

 

Equivalent Circuit


Power Derating Curves in Free Air


 

Response Characteristics

 
Ordering Information

ExampleTS3 57 B3 ]
TS3
XX
Mounting Tab
Model
Temperature in †C
B3 or C3
 

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