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Thermal Sensors Moxie®

Thermal Sensor MOXIE®
Moxies are a family of, variable resistance thermal sensors having a highly specific “transition region.” Within this transition region the devices typically exhibit a negative temperature coefficient ranging from 40% per °C to 200% per °C. Below the transition region they exhibit a linear “thermistor” characteristic of -2 to -4%/°C.

TS3

Applications

Sensors for temperature protection, control and limiting. Voltage, current and frequency limiters in electronics.
Examples: Overtemperature protector for power semi-conductors, such as transistors, power output stages, amplifiers.

Dimensions

TS3

TS3 B3

TS3 C3

Specifications

Type Parameter Temp, (°C) Condition Min. Typ. Max. Units
TS3-57 Resistance 35 Heating 35 85 230 k
Resistance 57 Heating 1.0 k
Resistance 75 Heating 15 45 100
Sensitivity (1) 57 Heating 40 100 % / °C
Latching Current (2) D.C. Volts 0.6 1.8 3.2 mA
Type Parameter Temp, (°C) Condition Min. Typ. Max. Units
TS3-60 Resistance 35 Heating 50 130 350 k
Resistance 60 Heating 5 k
Resistance 75 Heating 20 75 250
Sensitivity (1) 60 Heating 40 100 % / °C
Latching Current (2) D.C. Volts 0.6 1.6 2.8 mA
Type Parameter Temp, (°C) Condition Min. Typ. Max. Units
TS3-65 Resistance 40 Heating 120 620 1700 k
Resistance 65 Heating 5.0 k
Resistance 80 Heating 10 50 100
Sensitivity (1) 65 Heating 80 200 % / °C
Latching Current (2) D.C. Volts 0.14 0.33 0.52 mA
Type Parameter Temp, (°C) Condition Min. Typ. Max. Units
TS3-75 Resistance 55 Heating 40 80 300 k
Resistance 75 Heating 3.0 k
Resistance 95 Heating 20 115 200
Sensitivity (1) 75 Heating 50 70 % / °C
Latching Current (2) D.C. Volts 0.7 1.9 3.1 mA
Type Parameter Temp, (°C) Condition Min. Typ. Max. Units
TS3-85 Resistance 65 Heating 25 45 180 k
Resistance 85 Heating 1.5 k
Resistance 100 Heating 75 150 330
Sensitivity (1) 85 Heating 30 40 % / °C
Latching Current (2) D.C. Volts 1.4 2.0 2.6 mA

1 Sensitivity is defined as the percentage of resistance change per variation of 1†C in temperature.
2 Latching current is the smallest current that will cause the device to make changes in resistance while it’s cooling to a lower temp.

Typical Characteristics TS3-XX TS3-XXB3
Thermal Resistance (†C/W)
– Die to tab (or casing) 250 300
– Tab (or case) to air 200 200
Time Constant (sec)
– Air to tab (or casing) 60 60
– Tab (or case) to die 2.0 2.5
Shunt Capacitance (pF)
– Lead to lead 0.5 0.5
– Lead to tab (or casing) 0.2 0.2
Dialectric Withstanding (V dc)
– Lead to tab (or casing) 600 600
Storage Temp. (†C) 120 120
Solder Temp.
(1/16” from case, 10 sec) 260 260
Typical Response
Characteristics
TS3-57 TS3-60 TS3-65 TS3-75 TS3-85
Temp.Coef. (%/†C)
Pre-Transition -2.0 -2.5 -4.0 -3.5 -3.0
Transition -100 -100 -200 -70 -40
Post-Transition -0.25 -0.25 -0.5 -1.0 -1.5

Equivalent Circuit

Power Derating Curves in Free Air

Response Characteristics

Ordering Information

Example [ TS3 57 B3 ]
TS3 XX Mounting Tab
Model Temperature in †C B3 or C3